01 Shenzhen Vision China 2026
02 Booth Location
03 Featured Products and Applications
At this exhibition, LightE will showcase its core products, including chromatic confocal displacement sensors, designed for inspection applications across optical communications, semiconductors, consumer electronics, optical components, and other industries.
LightE’s chromatic confocal displacement sensors measure wafer thickness using an opposed-sensor configuration. The upper and lower probes acquire data simultaneously, enabling fast, non-contact thickness measurement to meet the high-precision inspection requirements of semiconductor manufacturing processes.
To address key industry challenges such as micron-level thickness measurement, curved-surface profile scanning, transparent-object inspection, and small-gap measurement, our technical sales engineers will conduct live demonstrations at the exhibition.
Using chromatic confocal displacement sensors, the system non-contact scans the chip placement area and collects height data at multiple points. It calculates surface height variations and warpage, enabling efficient, comprehensive inspection of chip placement flatness.
We look forward to seeing you at LightE’s Booth 9K42, Hall 9, Shenzhen World Exhibition & Convention Center (Bao’an), from October 27 to 29, 2026!
For more information about the exhibition or to discuss product demonstrations in advance, please feel free to contact us.
Contact
Official website: www.lightegroup.com
Inquiry hotline: +86 755 2826 3345