PCB is prone to warping after reflow soldering or heat treatment, which affects subsequent placement yield.
LightE uses high-precision non-contact measurement technology to scan the PCB surface height distribution and quantify flatness and warpage.
PCB is prone to warping after reflow soldering or heat treatment, which affects subsequent placement yield.
LightE uses high-precision non-contact measurement technology to scan the PCB surface height distribution and quantify flatness and warpage.