Semiconductor
Dedicated to wafer flatness, thinning thickness, and lead topography measurement after packaging, overcoming interference from highly reflective materials.
Optical Communication
High-precision dimension and height consistency inspection for optical modules and component manufacturing, suitable for microstructures and highly reflective surfaces.
Consumer Electronics
Serving precision consumer electronics manufacturing to achieve high-precision dimension and height difference measurements for tiny structures and complex curved surfaces.
Optics
High-resolution, highly stable non-contact measurement solutions for optical components and precision structural parts.
Lithium Battery
Applied in critical lithium battery manufacturing processes to achieve high-precision inline inspection of electrodes, electrolytes, and structural components.
Display Panel
Full-process support for display panel manufacturing, enabling high-precision measurement of glass substrates, film layers, and module structures.
Medical
Meeting high-precision non-destructive inspection demands for medical devices and polymer materials, suitable for transparent and multi-layer structures.
Film / Sheet
Focusing on inline thickness and uniformity inspection for various functional films and sheets, supporting multi-layer structure analysis.
Photovoltaics
Applied in photovoltaic manufacturing to achieve high-precision measurement and quality control for silicon wafers, solar cells, and thin films.
Dispensing
Precision inspection and process optimization of glue volume, glue height, and topography during the dispensing process.
Automotive Manufacturing
Serving automotive manufacturing and component inspection, meeting precision measurement requirements for complex structural parts and highly reflective surfaces.
Glass Industry
Suitable for thickness and surface measurements of various industrial glasses, especially ideal for transparent and highly reflective materials.
PCB/FPC
Designed for PCB manufacturing and inspection processes to achieve high-precision measurement of board thickness, copper layers, and microstructures.