01 Shenzhen Bay Chip Expo
From October 14 to 16, 2026, the 2026 Greater Bay Area Semiconductor Industry Ecosystem Expo Shenzhen will open at Shenzhen Convention and Exhibition Center Futian. As a leading Chinese manufacturer of chromatic confocal displacement sensors, LightE Tech cordially invites you to visit Hall 8, Booth 8F17 and see how precision optical measurement technology is supporting breakthroughs and innovation in China’s semiconductor industry.
02 Booth Guide
LightE Tech Booth: Hall 8, Booth 8F17
03 Exhibit Preview
As a leading Chinese provider of chromatic confocal displacement sensors, LightE Tech delivers high-accuracy, high-stability, one-stop inspection solutions for the semiconductor industry. These solutions address inspection challenges in wafer processing, chip mounting, and advanced packaging, including flatness, warpage, thickness, and surface profile measurement.
Chromatic confocal displacement sensors measure wafer thickness in an opposed-sensor configuration. Upper and lower sensors collect data simultaneously, enabling fast, non-contact wafer thickness measurement that meets the high-accuracy inspection requirements of semiconductor processes.
At Shenzhen Bay Chip Expo, LightE Tech will present its core precision inspection equipment and customized industry solutions. We will demonstrate advanced inspection technology and practical application cases for the semiconductor value chain, showing the core value of precision optical inspection in semiconductor manufacturing.
For 3D profile inspection of BGA and CSP solder balls, LightE Tech uses a high-accuracy 3D line chromatic confocal sensor together with a fully automated XY linear scanning module. The system continuously scans the full BGA and CSP chip area and rapidly generates a complete 3D point-cloud model.
Contact
Official website: www.lightegroup.com
Inquiry hotline: +86 755 2826 3345