{"id":875,"date":"2026-03-17T15:29:53","date_gmt":"2026-03-17T07:29:53","guid":{"rendered":"https:\/\/lighte.gongjionline.cn\/cus_case\/pcb-ban-mian-ping-zheng-du-yu-qiao-qu-du-jian-ce\/"},"modified":"2026-08-25T17:51:28","modified_gmt":"2026-08-25T09:51:28","slug":"pcb-flatness-warping","status":"publish","type":"case","link":"https:\/\/www.lightegroup.com\/pt\/case\/pcb-flatness-warping\/","title":{"rendered":"Detec\u00e7\u00e3o de planicidade e empenamento de PCBs"},"content":{"rendered":"<p>A PCB tende a apresentar deforma\u00e7\u00f5es ap\u00f3s a soldagem por refus\u00e3o ou o tratamento t\u00e9rmico, o que afeta o rendimento do posicionamento subsequente.<\/p>\n<p>LightE utiliza tecnologia de medi\u00e7\u00e3o sem contato de alta precis\u00e3o para escanear a distribui\u00e7\u00e3o da altura da superf\u00edcie da placa de circuito impresso e quantificar a planicidade e a deforma\u00e7\u00e3o.<\/p>","protected":false},"featured_media":3741,"template":"","meta":{"_acf_changed":false,"_seopress_robots_primary_cat":"","_seopress_titles_title":"PCB flatness and warpage detection - LightE Application","_seopress_titles_desc":"PCB is prone to warping after reflow soldering or heat treatment, which affects subsequent placement yield.","_seopress_robots_index":"","_seopress_analysis_target_kw":""},"class_list":["post-875","case","type-case","status-publish","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.lightegroup.com\/pt\/wp-json\/wp\/v2\/case\/875","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lightegroup.com\/pt\/wp-json\/wp\/v2\/case"}],"about":[{"href":"https:\/\/www.lightegroup.com\/pt\/wp-json\/wp\/v2\/types\/case"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lightegroup.com\/pt\/wp-json\/wp\/v2\/media\/3741"}],"wp:attachment":[{"href":"https:\/\/www.lightegroup.com\/pt\/wp-json\/wp\/v2\/media?parent=875"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}