{"id":835,"date":"2026-03-17T15:29:51","date_gmt":"2026-03-17T07:29:51","guid":{"rendered":"https:\/\/lighte.gongjionline.cn\/cus_case\/gui-pian-qiao-qu-yu-ttv-jian-ce\/"},"modified":"2026-07-14T17:06:35","modified_gmt":"2026-07-14T09:06:35","slug":"wafer-warp-ttv","status":"publish","type":"case","link":"https:\/\/www.lightegroup.com\/pt\/case\/wafer-warp-ttv\/","title":{"rendered":"Distor\u00e7\u00e3o da bolacha de sil\u00edcio e detec\u00e7\u00e3o de TTV"},"content":{"rendered":"<p>O empenamento excessivo da bolacha e a varia\u00e7\u00e3o total de espessura (TTV) levar\u00e3o a uma diminui\u00e7\u00e3o dos rendimentos subsequentes de texturiza\u00e7\u00e3o, difus\u00e3o e impress\u00e3o.<\/p>","protected":false},"featured_media":1268,"template":"","meta":{"_acf_changed":false,"_seopress_robots_primary_cat":"","_seopress_titles_title":"Silicon wafer warpage and TTV detection - LightE Application","_seopress_titles_desc":"Excessive wafer warpage and total thickness variation (TTV) will lead to a decrease in subsequent texturing, diffusion and printing yields.","_seopress_robots_index":"","_seopress_analysis_target_kw":""},"class_list":["post-835","case","type-case","status-publish","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.lightegroup.com\/pt\/wp-json\/wp\/v2\/case\/835","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lightegroup.com\/pt\/wp-json\/wp\/v2\/case"}],"about":[{"href":"https:\/\/www.lightegroup.com\/pt\/wp-json\/wp\/v2\/types\/case"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lightegroup.com\/pt\/wp-json\/wp\/v2\/media\/1268"}],"wp:attachment":[{"href":"https:\/\/www.lightegroup.com\/pt\/wp-json\/wp\/v2\/media?parent=835"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}