{"id":875,"date":"2026-03-17T15:29:53","date_gmt":"2026-03-17T07:29:53","guid":{"rendered":"https:\/\/lighte.gongjionline.cn\/cus_case\/pcb-ban-mian-ping-zheng-du-yu-qiao-qu-du-jian-ce\/"},"modified":"2026-08-25T17:51:28","modified_gmt":"2026-08-25T09:51:28","slug":"pcb-flatness-warping","status":"publish","type":"case","link":"https:\/\/www.lightegroup.com\/fr\/case\/pcb-flatness-warping\/","title":{"rendered":"D\u00e9tection de la plan\u00e9it\u00e9 et du gauchissement des circuits imprim\u00e9s"},"content":{"rendered":"<p>Le PCB a tendance \u00e0 se d\u00e9former apr\u00e8s le soudage par refusion ou un traitement thermique, ce qui affecte le rendement du placement ult\u00e9rieur.<\/p>\n<p>LightE utilise une technologie de mesure sans contact de haute pr\u00e9cision pour scanner la distribution de la hauteur de la surface du circuit imprim\u00e9 et quantifier la plan\u00e9it\u00e9 ainsi que la d\u00e9formation.<\/p>","protected":false},"featured_media":3741,"template":"","meta":{"_acf_changed":false,"_seopress_robots_primary_cat":"","_seopress_titles_title":"PCB flatness and warpage detection - LightE Application","_seopress_titles_desc":"PCB is prone to warping after reflow soldering or heat treatment, which affects subsequent placement yield.","_seopress_robots_index":"","_seopress_analysis_target_kw":""},"class_list":["post-875","case","type-case","status-publish","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.lightegroup.com\/fr\/wp-json\/wp\/v2\/case\/875","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.lightegroup.com\/fr\/wp-json\/wp\/v2\/case"}],"about":[{"href":"https:\/\/www.lightegroup.com\/fr\/wp-json\/wp\/v2\/types\/case"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.lightegroup.com\/fr\/wp-json\/wp\/v2\/media\/3741"}],"wp:attachment":[{"href":"https:\/\/www.lightegroup.com\/fr\/wp-json\/wp\/v2\/media?parent=875"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}